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Broadband Dielectric Characterization and Design Optimization of Silicate Materials for Advanced Packaging Applications Measurements

Online , Germany

Event Info: Speaker:  Dr. Rocío Rodríguez Cano Assistant Professor Antennas, Propagation and Mm-wave Systems Section, Aalborg University, Denmark IEEE AP-S YP Ambassador  Title of Talk: Broadband Dielectric Characterization and Design Optimization of Silicate Materials for Advanced Packaging Applications Measurements When: 19th August 2025 at 6:00 pm CEST Where: G-Meet, receiving the link by registration at :  https://www.eventbrite.de/e/ieee-young-professionals-germany-technical-talks-dr-rocio-rodriguez-cano-tickets-1533304136949?utm-campaign=social&utm-content=attendeeshare&utm-medium=discovery&utm-term=listing&utm-source=cp&aff=ebdsshcopyurl

IEEE World Technology Summit on “Digital Automotive Technologies”

Berlin , Germany

Your or your company members to Germany maybe to attend IFA in Berlin (in September this year)? Join us at the IEEE World Technology Summit on “Digital Automotive Technologies”. This is a full day industry event held at the Estrel Hotel in Berlin on September 8th, 2025. Explore the digital technologies shaping the next generation of vehicular and mobile consumer services. Co-located with IEEE ICCE-Berlin 2025 and IFA Berlin It brings together senior leaders responsible for automotive product and service development to share successes and challenges in innovation across: Autonomy, Software, Infrastructure, and Devices. Meet Speakers from the Automotive Industry who will discuss the challenges and strategies for the next generation of products. WTS is a highly interactive event where you will get a chance to be part of the dialog that establishes the next generation of Technologies, Policies, and Standards for the Automotive Industry - the focus is on digital  products and services that are now in the wings for development.

IEEE WESYP 2025

Hamburg , Germany

IEEE WESYP 2025 will take place in Hamburg from 11 to 13 September 2025: 🔗 Facebook Post: https://www.facebook.com/wesypr8/posts/122143024178750530 🔗 LinkedIn Post: https://www.linkedin.com/feed/update/urn:li:activity:7350642781708570624 📌 Registration Deadline: 17 August 2025, 23:59 CET

IEEE SPICE Talk@TUM 12 Sep 2025

München Technical University of Munich, München, Germany

SPICE stands for Simulation Program with Integrated Circuit Emphasis, while integrated circuit design is a domain where computer-aided design (CAD) is mandatory. Most commercial versions of SPICE are based on SPICE2, specifically the G6 version from the University of California, Berkeley. The material presented in the workshop will cover a brief history of SPICE, its main objectives, analysis types, algorithms, and key convergence topics. The newest research directions will also be addressed. A wide audience from industry and academia is expected to show a great interest in the Workshop Prof. Andrei Vladimirescu U.C. Berkeley AGENDA IEEE Presentation: 9:30 - 9:45 SPICE (Part I): 9:45 - 12:00 Coffee Break: 12:00 - 12:30 SPICE (Part II): 12:30 - 13:30 Q & A Session: 13:30 – 14:00 Where? Technische Universität München Theresienstr. 90, Gebäude N3, 5. St, Raum N5325 80333 München

The 50th IEEE Conference on Local Computer Networks (LCN) October 14-16, 2025, Sydney, Australia

The IEEE LCN conference is the premier conference on theoretical and practical aspects of computer networking. LCN is highly interactive, enabling an effective interchange of results and ideas among researchers, users, and product developers. Major developments from high-speed networks to the global Internet to specialized sensor networks have been reported at past LCNs. Please join us for LCN 2025, our 50th annual meeting, in Sydney, Australia! https://www.ieeelcn.org/ Important Dates Paper Registration: April 20, 2025 (AoE) Paper Submission: April 27, 2025 (AoE) Paper Acceptance Notification: July 1, 2025 (AoE) Final Paper Due: August 1, 2025 (AoE)

IEEE EMC Young Professional Day

Meet and connect with fellow young professionals during this year’s IEEE Young Professionals Event in Berlin, Germany. Participate in a guided tour at the Fraunhofer Institute for Reliability and Microintegration (Fraunhofer IZM) which includes a look at their anechoic chamber, power electronics lab, and packaging & prototyping line. Join us for our social event afterwards! Date: 23.10.2025 Event Details