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IEEE WESYP 2025

Hamburg

IEEE WESYP 2025 will take place in Hamburg from 11 to 13 September 2025: 🔗 Facebook Post: https://www.facebook.com/wesypr8/posts/122143024178750530 🔗 LinkedIn Post: https://www.linkedin.com/feed/update/urn:li:activity:7350642781708570624 📌 Registration Deadline: 17 August 2025, 23:59 CET

IEEE SPICE Talk@TUM 12 Sep 2025

München Technical University of Munich, München

SPICE stands for Simulation Program with Integrated Circuit Emphasis, while integrated circuit design is a domain where computer-aided design (CAD) is mandatory. Most commercial versions of SPICE are based on SPICE2, specifically the G6 version from the University of California, Berkeley. The material presented in the workshop will cover a brief history of SPICE, its main objectives, analysis types, algorithms, and key convergence topics. The newest research directions will also be addressed. A wide audience from industry and academia is expected to show a great interest in the Workshop Prof. Andrei Vladimirescu U.C. Berkeley AGENDA IEEE Presentation: 9:30 - 9:45 SPICE (Part I): 9:45 - 12:00 Coffee Break: 12:00 - 12:30 SPICE (Part II): 12:30 - 13:30 Q & A Session: 13:30 – 14:00 Where? Technische Universität München Theresienstr. 90, Gebäude N3, 5. St, Raum N5325 80333 München