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EMC Professional Talk “High-end Server Packaging: Trends and Challenges in Next Generations”

Name: EMC Professional Talk “High-end Server Packaging: Trends and Challenges in Next Generations”
Start: 2022-10-18T17:00:00+02:00
End: 2022-10-18T19:00:00+02:00

18. October 2022 @ 17:00 - 19:00 CEST

Dr.-Ing. Xiaomin Duan, Electronic packaging for High-End Server, IBM Research & Development GmbH, Böblingen, Germany
18.10.2022, 17:00 Uhr
Zoom-Meeting
https://r8.ieee.org/germany-emc/wp-content/uploads/sites/146/2022/08/ieee_german_emc_chapter_professional_talk_Duan.pdf