Germany Section Solid-State Circuits Society Chapter

 

 

Upcoming events

  • The German Chapter of the IEEE Consumer Technology Society is pleased to announce a webinar by Prof. Dr. Jasmin Aghassi-Hagmann of the Karlsruhe Institute of Technology (KIT) that will take place on 15 November 2024 from 18.00 to 19.30. All members of the German IEEE SSCS Chapter, as well as every other interested person, are heartily welcome to participate in this event.
     

    Recent advances in printable materials and thin film electronic devices and circuits

    https://events.vtools.ieee.org/m/441293

    Date and Time

    • Date: 15 Nov 2024
    • Time: 06:00 PM to 07:30 PM
    • All times are (UTC+01:00) Berlin
     

    Location

    • Virtual attendance
     

    Host

    • Germany Section Chapter, SSC37
     

    Registration

     

    Speaker Biography

     

    Prof. Dr.-Ing. Jasmin Aghassi-Hagmann of Karlsruhe Institute of Technology (KIT)


    Jasmin Aghassi-Hagmann is a full professor at the Institute of Nanotechnology (INT) of the Karlsruhe Institute of Technology (KIT) in the Department of Electrical Engineering and Information Technology. She received her diploma in physics from RWTH Aachen and PhD from KIT, Karlsruhe. She has spent several years in R&D in the semiconductor industry (Infineon Technologies, IBM Semiconductor Alliance East Fishkill, Intel) developing advanced CMOS nodes. Her research interests are solution processible materials, 2D and 3D functional printing as well as thin film electronic devices and circuits. She serves in various national and international committees such as topic speaker in the Helmholtz Society Research Program Materials System Engineering, and is a member of the executive editorial boards of J-FPE and IEEE J-FLEX and others. 

    Webinar Description

    Printed and flexible electronics enable interesting novel applications in the fields of sensors [1], bioelectronics [2], and security applications [3], to name but a few. Most of them gain their functionality from a layered structure composed of different materials that interact with each other. For semiconducting layers, organic and inorganic materials can be used; in this regard, the respective functional materials need to be formulated into inks that are then printed on various substrates. The structuring process of printing is a complex process in which many chemical and physical process parameters need to be controlled at the same time, such as drop volume, the waveform of the electrical signal controlling droplet formation, or the drying time. Also, the surface of the substrate plays a decisive role in printing accuracy and layer morphology. After printing, post-treatments are often necessary to obtain the desired features, since the properties of bulk materials often differ from printed nanoparticulate or precursor-derived layers.

    This presentation starts by introducing various semiconducting inks based on either nanoparticle or precursor solutions and discusses thin film properties, microstructure, and finally the step-by-step device fabrication processes. Various printing techniques such as (super)-inkjet, laser printing and microplotting will be shown. These printed materials display advantages such as high carrier mobilities, transparency, stability in air, non-toxicity, and can be prepared mostly by using water or alcohol-based solvents. Finally, examples of hybrid sensor systems comprising printed and standard CMOS components will be elaborated on.

    [1] Cadilha Marques, Gabriel, Dennis Weller, Ahmet Turan Erozan, Xiaowei Feng, Mehdi Tahoori, und Jasmin Aghassi‐Hagmann. „Progress Report on “From Printed Electrolyte‐Gated Metal‐Oxide Devices to Circuits”. Advanced Materials 31, Nr. 26 (Juni 2019): 1806483. https://doi.org/10.1002/adma.201806483.

    [2] Mahsa K. Saghafi, Srivatsan K. Vasantham, Navid Hussain, George Mathew, Federico Colombo, Barbara Schamberger, Eric Pohl, Gabriel Cadilha Marques, Ben Breitung, Motomu Tanaka, Martin Bastmeyer, Christine Selhuber-Unkel, Ute Schepers, Michael Hirtz, Jasmin Aghassi-Hagmann, “Printed Electronic Devices and Systems for Interfacing with Single Cells up to Organoids”, Adv. Funct. Mat., Early View, 2023, https://doi.org/10.1002/adfm.202308613

    [3] Zimmermann, Lukas, Alexander Scholz, Mehdi B. Tahoori, Jasmin Aghassi-Hagmann, und Axel Sikora. „Design and Evaluation of a Printed Analog-Based Differential Physical Unclonable Function“. IEEE Transactions on Very Large Scale Integration (VLSI) Systems 27, Nr. 11 (November 2019): 2498–2510. https://doi.org/10.1109/TVLSI.2019.2924081.

    Webinar Agenda

    1. Introduction and greetings – 5 minutes
    2. Main talk – 55 to 60 minutes
    3. Q&A – 25 to 30 minutes
 

Recent past events

  • BIO-IMPLANTABLE INTEGRATED CIRCUITS: OPPORTUNITIES, CHALLENGES AND THE FUTURE

     

    Date and Time

    • Date: 23 Jun 2024
    • Time: 06:00 PM to 07:30 PM
    • All times are (UTC+02:00) Berlin
     

    Location

    • Virtual attendance.
     

    Hosts

    • Germany Section Chapter, SSC37
    • Germany Section Chapter, CAS04
    • Egypt Section Chapter, SSC37
     

    Registration

    • Starts 02 June 2024 12:00 AM
    • Ends 23 June 2024 12:00 AM
    • All times are (UTC+02:00) Berlin
    • No Admission Charge
     

    Speaker

    • Prof. Dr.-Ing. Moustafa Nawito of IU Internationale Hochschule / Polymath Analog

    Motivation

    Implantable electronics play an essential role in the Advancement of medical devices. The introduction of the pacemaker in 1958 ushered in the era of active implants. Since then, numerous applications have benefited from Implantable electronics, such as cochlear implants and Nerve stimulators. With the advent of integrated circuits and new Manufacturing technologies, implantable electronics have Been used in new areas outside the healthcare industry. Over the years, a wealth of knowledge has accumulated in which specialized design techniques and circuits have been developed to meet the needs of implantable applications.

    Aim

    This Talk offers a comprehensive overview on the topic of implantable electronics. A primary focus is on presenting the special requirements and specifications of implantable electronics that arise from their respective applications, as well as an overview of the various techniques and methods used to meet these requirements. The electronic components of several implantable devices are presented, in addition to the corresponding manufacturing processes. Discussion of the technical aspects of implantable electronics will be followed by a discussion of the various applications, including emerging trends, directions and challenges.

    Speaker Biography

    Moustafa Nawito was born in 1979 in Cairo Egypt. He attained his B.Sc. in Electronics and Electrical Communication Engineering from the faculty of engineering at Cairo University in 2002 and his M.Sc. in RF Electronics from the German university in Cairo in 2007. In 2017 he attained his Dr.-Ing. (Magna cum laude) in Microelectronics from Stuttgart University in Germany. In 2008 he was appointed as technical manager of the research center for digital broadcasting at GUC in cooperation with Fraunhofer Institute IIS in Erlangen Germany. During this time, he conducted several seminars and workshops on advanced ASIC design for industrial and academic partners. He also co-founded the “Center for Artificial Intelligence” and led a research team to win the international RoboCup scientific competition in 2009. He was also a co-founder of the Egyptian IEEE chapter for computational intelligence which received the best chapter award in 2009. In 2010 he joined the Institut für Mikroelektronik Stuttgart IMS CHIPS as a senior ASIC designer, where he was responsible for the development of novel circuits for camera systems, industrial sensors and biomedical intelligent implants for diagnosis and therapy for Bosch, Daimler, and other industrial clients. In addition, he was the scientific project director of various German and international research projects. In 2017 he founded the startup company Polymath Analog where he works in close cooperation with customers to provide innovative and reliable ASIC solutions for the Internet of Things, Industry 4.0 and automotive applications, with special emphasis on advanced analog design. He served as lead consultant for the development of a new generation of implantable image sensors for the company Retina Implant AG. In 2020 he joined the IU International University of Applied Sciences as a professor and founding chair of the electrical engineering program. He successfully led the development of the curriculum and the academic accreditation of the newly established department. He also serves as a scientific reviewer on several committees for the appointment of new Professors. Prof. Nawito is the author of several publications, including the textbook “CMOS Readout Chips for Implantable Multimodal Smart Biosensors (Springer)”. His research interests include the design of low-power data converters, high-precision sensors and organic and implantable electronics. He is a senior member of IEEE, VDE, OE-A and other technical societies and associations. He is the chair of the SSCS chapter and secretary of the CAS chapter in Germany. In addition, he is an expert reviewer for the accreditation of engineering university programs for the EU and has conducted on-site reviews in 4 continents.

Prof. Dr. Moustafa Nawito

IU Internationale Hochschule GmbH

moustafa.nawito@gmail.com