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DTSTART;TZID=Europe/Berlin:20221007T080000
DTEND;TZID=Europe/Berlin:20221007T170000
DTSTAMP:20260526T093940
CREATED:20220905T151754Z
LAST-MODIFIED:20220905T151914Z
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SUMMARY:Distinguished Lecture "Package Requirements for Data Rates of 112 Gbps and Beyond"
DESCRIPTION:Dr. Wendem Beyene\, Facebook Inc\, Menlo Park\, USA\n07.10.22\, 16:00 – 17:00 Uhr\nHamburg University of Technology (TUHH)\nhttps://r8.ieee.org/germany-emc/wp-content/uploads/sites/146/2022/08/IEEE_German_EMC_Chapter_DL_Talk_Wendem_Beyene_2022.pdf
URL:https://www.ieee.de/event/distinguished-lecture-package-requirements-for-data-rates-of-112-gbps-and-beyond/
LOCATION:Hamburg\, Germany
ATTACH;FMTTYPE=image/jpeg:https://www.ieee.de/wp-content/uploads/2021/09/Vehicle-network-design_1920x1080_tcm27-83192-1.jpg
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DTSTART;TZID=Europe/Berlin:20221012T080000
DTEND;TZID=Europe/Berlin:20221014T170000
DTSTAMP:20260526T093940
CREATED:20220211T100405Z
LAST-MODIFIED:20220211T100405Z
UID:2222-1665561600-1665766800@www.ieee.de
SUMMARY:2022 Sensor Data Fusion: Trends\, Solutions\, Applications (SDF)
DESCRIPTION:2022 Sensor Data Fusion: Trends\, Solutions\, Applications (SDF) wird in Bonn vom 2022-10-12 bis 2022-10-14 stattfinden. Die  IEEE Aerospace and Electronic Systems Society ist ein Sponsor dieser Veranstaltung. https://www.fkie.fraunhofer.de/de/Veranstaltungen/sdf2022.html \n2022  Sensor Data Fusion: Trends\, Solutions\, Applications (SDF) is scheduled to be held in Bonn on 2022-10-12 to 2022-10-14. The  IEEE Aerospace and Electronic Systems Society is a sponsor of this event. https://www.fkie.fraunhofer.de/de/Veranstaltungen/sdf2022.html
URL:https://www.ieee.de/event/2022-sensor-data-fusion-trends-solutions-applications-sdf/
LOCATION:Bonn\, Germany
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DTSTART;TZID=Europe/Berlin:20221018T170000
DTEND;TZID=Europe/Berlin:20221018T190000
DTSTAMP:20260526T093940
CREATED:20220905T152015Z
LAST-MODIFIED:20220905T152015Z
UID:2383-1666112400-1666119600@www.ieee.de
SUMMARY:EMC Professional Talk "High-end Server Packaging: Trends and Challenges in Next Generations"
DESCRIPTION:Dr.-Ing. Xiaomin Duan\, Electronic packaging for High-End Server\, IBM Research & Development GmbH\, Böblingen\, Germany\n18.10.2022\, 17:00 Uhr\nZoom-Meeting\nhttps://r8.ieee.org/germany-emc/wp-content/uploads/sites/146/2022/08/ieee_german_emc_chapter_professional_talk_Duan.pdf
URL:https://www.ieee.de/event/emc-professional-talk-high-end-server-packaging-trends-and-challenges-in-next-generations/
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