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UID:2383-1666112400-1666119600@www.ieee.de
SUMMARY:EMC Professional Talk "High-end Server Packaging: Trends and Challenges in Next Generations"
DESCRIPTION:Dr.-Ing. Xiaomin Duan\, Electronic packaging for High-End Server\, IBM Research & Development GmbH\, Böblingen\, Germany\n18.10.2022\, 17:00 Uhr\nZoom-Meeting\nhttps://r8.ieee.org/germany-emc/wp-content/uploads/sites/146/2022/08/ieee_german_emc_chapter_professional_talk_Duan.pdf
URL:https://www.ieee.de/event/emc-professional-talk-high-end-server-packaging-trends-and-challenges-in-next-generations/
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